Key Features
- Effective "zero bonding"
- Controlled thickness bonding
- Precise bond orientation
- Large or multiple sample capacity
- Bonding jigs available for large or small scale operations
Description
The production of thin and ultra-thin sections of materials requires that the sample material be fixed to a substrate (e.g. a glass microscope slide) for support during processing.
In particular, when using an automated thin section production system, it is important that the orientation of the sample-bond-substrate is controlled for achieving optimal sample thickness control and parallelism.
"Zero bonding" and "controlled thickness bonding" are two important techniques developed by Logitech to enable bond orientation and thickness to be controlled easily and with great precision.
Logitech offer four types of bonding jig: the BJ12, BJ9, BJ6 and BJ2. Each is ideally suited to different bonding requirements, yet all have the same basic design.
Product Options
The Thin Section Bonding Jig range is as follows:
- Twelve position zero bonding jig with the facility for large thin section bonding [BJ12]
- Two position zero bonding jig for sections up to 102x152mm [BJ9]
- Six position zero bonding jig with facility for large thin sections [BJ6]
- Two position zero bonding jig for sections up to 76x110mm [BJ2]
Product Specification
| Power Supply : | BJ12 |
BJ9 |
BJ6 |
BJ2 |
| Height : | 240mm |
240mm |
240mm |
240mm |
| Depth : | 307mm |
260mm |
152mm |
152mm |
| Length : | 180mm |
220mm |
184mm |
220mm |
| Weight : | 12Kg |
9Kg |
6Kg |
6Kg |
For more information on the Thin Section Bonding Jigs, call us on +44 (0)1389 875444 or complete our contact form.