Bonding techniques for processing thin and fragile II-VI and III-V semiconductor wafers, along with geological thin section and other materials require delicate handling procedures. Laboratories bonding such materials need to maintain the highest quality of sample yield and minimise breakage of the materials in the preparation process.
As a result, Logitech have developed various bonding systems to cater for this requirement.
WSB2 Wafer Substrate Bonding Unit
This highly automated machine is designed for wax-mounting of semiconductor wafers to a quartz or sapphire support disc. The bonding process -- evacuation of the chamber, heating, pressure bonding and cooling -- can be completed automatically by the machine in 45 minutes, depending on the temperature.
BJ Bonding Jigs
A range of mechnaical bonding jigs to improve epoxy and wax bonding uniformity. "Zero bonding" and "controlled thickness bonding" are two important techniques developed by Logitech to enable bond orientation and thickness to be controlled easily and with great precision.
WSB300 Wafer Substrate Bonding Unit
The WSB300 allows operators to bond materials and wafers up to 300mm (12") in diameter to the same exacting standards achieved by the Logitech bench-top systems.
For more information on our bonding equipment and what Logitech technology will do for your business, call us on +44 (0)1389 875444 or complete our contact form.