Key Features
- Fully automated control panel plus 100 programmable process routes
- Process up to 8"ø semiconductor wafers, single or multiple ICs / MEMS devices
- Joystick operation with scroll through menu operation
- Polishing area flush mechanism
Description
The CDP automatic Chemical Mechanical Polishing system provides repeatable nanometer level accuracy for the majority of materials used in current day device fabrication processes. Due to its accuracy, low cost of ownership and ease of use, the CDP automatic polisher offers the ideal environment for Chemical Mechanical Polishing and delayering applications.
The CDP Auto allows you to achieve industry standards of control and layer removal for traditional CMOS technology, chemical mechanical polishing applications, such as STI and Damascene (acceptable WTWNU and WIDNU are achievable)
The programmable control panel can store up to 100 separate material process routes, with the ability to automatically start any given task on the completion of a previous route - this allows for greater flexibility and automation. Automated, repeatable planarizing and delayering of IC's, multiple/individual die and wafers up to a maximum of 8"ø can be carried out by scrolling through purpose designed control screens.
Available in two different sizes, the wafer/die carrier is suitable for carrying wafers with a maximum diameter of either 4" or 8" respectively. Once the wafer has been attached to the carrier, the desired level of load can be set using the easily operated joystick controls. Back pressure can be applied to the wafer in a similar manner with a maximum setting of 36psi (this may vary depending on the model) helping ensure an even level of polish over the face of the wafer.
The CDP automatic also has an End Point Detection (EPD) System that makes use of custom designed software to allow real time monitoring of the polishing operation without any measurement downtime.
An optional Wet Bench, built in the same style as the CDP machine, is available for delivery and containment of both polishing slurry and water for cleaning the wafer / die prior to their removal from the processing area. This Wet Bench can be attached to the CDP unit and offers users a convenient alternative for those without in-house containment or delivery systems (waste slurry containment can also be included as part of the modular option).
Product Specification
| Power Supply : | 220V/240V, 50Hz (Single Phase) |
| Fuse Rating : | 16A x 2 |
| Plate Speed : | 0-160rpm |
| Wafer Carrier Speed : | 0-130rpm |
| Wafer Back Pressure : | 0-2bar |
| Carrier Down Pressure : | 0-10bar |
| Plate Size : | 510mm (20") |
| Max Plate Temperature : | 60°C (140°F) |
| Slurry Flow Rate : | 0-500mls/min |
| Polishing Pad Flatness : | +/- 10µm |
| Timer : | 0-10 hours |
| Recipe Storage : | 100 recipes |
| Internal Water Tank : | 3kW heating element |
| Main Drive Motor : | 2.2kW |
| Height : | 1854mm |
| Depth : | 935mm |
| Width : | 665mm |
| Weight : | 650Kg (gross weight) 534Kg (net weight) |
For more information on the CDP Auto Chemical Mechanical Polishing system, call us on +44 (0)1389 875444 or complete our contact form.