Logitech's chemical mechanical polishing systems are highly versatile and ideally suited for use in polishing applications where geometric precision, accuracy and surface quality are of paramount importance.
Our chemical mechanical polishing system solutions offer nanometer level material removal capability on either individual die or on wafers up to a maximum of 300mm (12") diameter and can be used with the wide variety of wafer and substrate materials used in current day device fabrication processes. For more detailed information regarding chemical mechanical polishing , visit our CMP knowledge base.
CDP 300 Chemical Mechanical Polishing System
The 300mm (12") diameter capacity CDP chemical mechanical polishing System is the largest unit in the Logitech CDP range and is ideal for CMP applications where high precision results are required to nanometer levels.
Orbis Chemical Mechanical Polishing System
The Orbis has been designed specifically as a pilot production Chemical Mechanical Polishing system. It is ideally suited for R&D environments where testing or developing new processes would otherwise require the use of expensive production oriented tools.
Tribo Chemical Mechanical Polishing System
The Tribo is a benchtop Chemical Mechanical Polishing machine capable of processing full or part wafers up to 4" (100mm) in diameter. It is supplied with a range of process data collection options offering in-depth analytical tools and allow for greater versatility and flexibility.
For more information on our chemical mechanical polishing systems and what Logitech technology will do for your business, call us on +44 (0)1389 875444 or complete our contact form.