Logitech's CMP抛光系统 是一种多用途化学抛光机械，它专门设计用于那些对几何精确度和表面质量要求严格的抛光应用。
我们的化学机械抛光系统解决方案可以达到纳米级材料去除，既可对单个模具进行纳米级的精确抛光，也可对直径大至12英寸的薄片进行抛光，可用于当今器件制造工艺中的诸多晶片及衬底材料的抛光。请访问 CMP相关知识.
Orbis Chemical Mechanical Polishing System
The Orbis has been designed specifically as a pilot production Chemical Mechanical Polishing system. It is ideally suited for R&D environments where testing or developing new processes would otherwise require the use of expensive production oriented tools.
Tribo Chemical Mechanical Polishing System
The Tribo is a benchtop Chemical Mechanical Polishing machine capable of processing full or part wafers up to 4" (100mm) in diameter. It is supplied with a range of process data collection options offering in-depth analytical tools and allow for greater versatility and flexibility.
CDP Automatic Chemical Mechanical Polishing System
THE CDP Automatic is a highly versatile polishing machine specifically designed for use in CMP and de-layering polishing applications where geometric precision and surface quality are of paramount importance.
CDP 300 Chemical Mechanical Polishing System
The 300mm (12") diameter capacity CDP chemical mechanical polishing System is the largest unit in the Logitech CDP range and is ideal for CMP applications where high precision results are required to nanometer levels.
需要更多关于化学机械抛光系统的信息，请至电 +86 (10)62564811，62538157或者填写我们的联系表格.