Logitech Ltd - World Leaders in cutting, lapping and polishing equipment

English | Deutsch | 中文

Technologie-Unterlagen (Prospekte)

Materials Processing Technology Brochures

Logitech stellt eine große Auswahl von Anwendungsunterlagen für die Materialverarbeitung zur Verfügung, um Ihnen ein besseres Verständnis der Technologien, die bei der Arbeit mit bestimmten Materialien und Anwendungen zum Tragen kommen, zu vermitteln.

Jeder Technologie-Prospekt beschreibt Verfahrensanforderungen, Methoden und Systemspezifikationen, die erforderlich sind, um eine Probe optimal bearbeiten zu können. Wählen Sie einfach eines der folgenden Dokumente, füllen Sie unser Kurzformular aus, und wir werden Ihnen die Literatur per Post zusenden.


Complete Systems for the Sawing, Lapping & Polishing of Electro-Optic Materials.
Complete Systems for the Sawing, Lapping & Polishing of Electro-Optic Materials.
Logitech has developed a fully integrated machine technology package for the processing of Silicon, Lithium Niobate, Lithium Tantalate, Bismuth Silicon Oxide, Barium Titanate and similar Electro-Optic materials to precise tolerances with scratch free surface finish. This brochure details the equipment and process involved in achieving high quality material processing results.

Optics: Adaptable Cutting, Lapping & Polishing Systems.
Optics: Adaptable Cutting, Lapping & Polishing Systems.
With the continued expansion and development of the telecommunications market the requirement for accurate processing of optical materials has never been more important. Whether for IR and polymer waveguide production or fibre-optic cable polishing, the exacting design and manufacture of standard Logitech equipment ensures the operator will achieve the highest results.

Precise Thinning of III-V Semiconductors, I.R., Opto-Electronic and Other Materials.
Precise Thinning of III-V Semiconductors, I.R., Opto-Electronic and Other Materials.
Logitech offer unique assistance with the problems of wafer surfacing, thinning and geometric control and with the integration of these processes into the customer's total fabrication programme for the production of thin or ultra-thin device wafers. This brochure provides a brief analysis of semiconductor and related applications for Logitech systems.

Precision Materials Diamond Sawing
Precision Materials Diamond Sawing
The fields of geological science, semiconductors, electro-optics and optics represent just a few areas where precision saws must meet diverse requirements. This Technology Brochure researches the techniques and Logitech equipment that are used to achieve high accuracy results in a wide range of material processing situations.
Homepage | Sitemap | Nutzungsbedingungen | Datenschutz | Kontakt | ©2009 Logitech Ltd