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DH300 Polishing Machine

DH300 Polishing Machine

Key Features

  • Single motor driven sweeping polishing head
  • Variable plate speed (0-160rpm)
  • Plate diameter of 560mm (20")
  • Process 1 x 300mm or 12 x 2"ø wafers
  • Idea for processing Sic, GaN, AIN, Sapphire and Nd:YAG

Description

Maximum Sample Capacity

The single station DH300 precision polishing machine provides both research and production orientated establishments with a high quality, automated polishing facility. Wafers, lenses, mirrors, prisms or components consisting of a wide variety of different materials can be polished with ease using the Logitech range of polishing cloths, plates and solutions.

A variety of different templates are available to suit individual requirements. The carrier head has a lightweight removable baseplate for fixing templates to.

Each template allows wafers or components to be held securely throughout the polishing process and work equally well with multiple groupings of wafers / components or single large diameter wafers up to 300mm.

The automated control screen allows the operator to set the following process parameters:

  • Plate and carrier rotation speed
  • Polishing solution feed rate
  • Carrier sweep
  • Start / Stop the polishing process

From the second page, it is possible to set the following process parameters:

  • Plate rotational direction
  • Carrier rotational direction
  • Carrier down pressure

Applications

The DH300 polishing machine can be used for polishing wafers, prisms, mirrors, lenses or components of virtually any optical or semiconductor material. Automated controls and independently adjustable process parameters make this single station unit ideal for those seeking to quicky polish wafers to an epitaxy ready surface. This versatility is heightened by the unit's ability to work with wafers and components of differing diameters and up to a maximum of 300mm.

Product Options

This product does not have any options available.

Product Specification

Power Supply : Single phase 220-230V
Fuse Rating : 13A
Plate Speed : 0-160rpm
Plate Size : 560mm (22")
Carrier Speed : 0-125rpm
Machine Capacity : 12 x 2" wafers per run
Height : 1800mm
Depth : 950mm
Width : 700mm

 

For more information on the DH300 Polishing Machine, call us on +44 (0)1389 875444 or complete our contact form.