Over time, there have been questions we have been asked on more than one occassion. Before logging a support call, make sure to check through our library of frequently asked questions first to see if your particular problem has been asked before.
We have broken the library down into clearly defined categories, allowing you to search for the appropriate topic more easily. As new questions are asked, we will be expanding and adding to the current number of topics so make sure to visit back again in future in case your question has been answered.
Below is the entire library of frequently asked questions. Choose
a category to narrow your search:
Category : Processes
Displaying 1 to 7 of 7
Why are my edge polished samples chipped and damaged?
Category : Processes
How do I lap and polish 4"/100mm diameter Silicon wafers?
Category : Processes
How do I lap and polish Gallium Arsenide wafers?
Category : Processes
How can I prevent polishing scratches on the surface of my compound semiconductor wafer? (GaAs, InP, MCT, CdTe, CdZnTe etc…)
Category : Processes
What are the required starting parameters for bonding with the Logitech WSB system?
Category : Processes
I use Glycol Phthalate to bond my wafers to a Silicon substrate (which is waxed to a glass carrier disk) and am noticing stress cracks in the wafers as I approach 40 microns in thickness. Why is this happening?
Category : Processes
How do I lap and polish Gallium Arsenide wafers?
Category : Processes