Logitech准备了各种材料加工应用报告，以使用户能够对了Logitech的产品有更深的了解。此外还有许多技术资料如产品画册等，其中介绍了详细的加工需求，方法和能够达到的参数指标，从下列菜单中选择感兴趣的文件并填写表格，我们会用邮递或者Email的方式发送给您。
|
Chemical Polishing. |
| Modern electronic devices require increasingly stringent control over wafer geometry in terms of surface flatness, specimen parallelism and thickness. It is also critical to achieve a high-quality surface finish in preparation for subsequent processes. Therefore, chemical polishing may be necessary in order to provide a superior surface with minimal damage to the crystal lattice structure. This Application Note focuses on the typical instances where chemical polishing is required, how chemical polishing works, and the equipment most suitable for your specific needs. |
|
Precise Thinning of III-V Semiconductors, I.R., Opto-Electronic and Other Materials. |
| Logitech offer unique assistance with the problems of wafer surfacing, thinning and geometric control and with the integration of these processes into the customer's total fabrication programme for the production of thin or ultra-thin device wafers. This brochure provides a brief analysis of semiconductor and related applications for Logitech systems. |
|
Precision Materials Diamond Sawing |
| The fields of geological science, semiconductors, electro-optics and optics represent just a few areas where precision saws must meet diverse requirements. This Technology Brochure researches the techniques and Logitech equipment that are used to achieve high accuracy results in a wide range of material processing situations. |
|
Silicon in Diverse Application Areas. |
| Whether for semiconductor or optical applications, the exacting design and manufacture of standard Logitech equipment ensures customers will achieve the highest quality results. This brochure gives a detailed overview of the processes involved. |
