Experience R&D level chemical mechanical polishing like never before with the Logitech Tribo system. With a full complement of analytical tools, our advanced Chemical Mechanical Polishing systems will allow you to delayer and analyse samples accurately and repeatably.
The Tribo is a benchtop Chemical Mechanical Polishing machine capable of processing full or part wafers up to 4" (100mm) in diameter and is supplied with a range of process data collection options offering in-depth analytical tools.
The benchtop dimensions allow for great flexibility and the machine features the use of a lightweight, 400mm plate allowing for easier plate changing and better shape quality. At this diameter, rigorous testing has proven that the wafer to plate ratio is sufficient enough to obtain the high uniformity and flatness required on small samples from a chemical mechanical polishing system.
The Tribo allows you to collect numerous data variables via the multiple sensors in order to identify and analyse various in-situ factors on the material samples being processed.
To further advance the usefulness of this data, cutting edge, real-time analytical software is utilised on a laptop PC to convert data into meaningful information. This data can be exported to data silos for future analysis or evaluated directly with software such as Microsoft Excel.
Applications
Primary applications areas are in the field of Tribology Science and Research, particularly with regards process and analysis results (eg. CoF).
The Tribo chemical mechanical polishing system is also readily adaptable as an enabling technology in Microelectromechanical Systems (MEMS) fabrication, particularly polysilicon surface micromachining, Opto-MEMS and Bio-MEMS packaging, assembly and even fabrication.
For more information on the Tribo Chemical Mechanical Polishing system, call us on +44 (0)1389 875444 or complete our product request form .